Journal of electronic packaging impact factor
NettetThe reliability of an electronic assembly is typically limited by the failure of one of the solder interconnections. One of the key factors that define the quality of solder interconnections is the s Nettet27. mai 2024 · Journal of Microelectronics and Electronic Packaging IS is decreased by a factor of 0.11 and approximate percentage change is -13.1% when compared to …
Journal of electronic packaging impact factor
Did you know?
NettetAbout. • Mechanical Engineering Professional with 7+ years of academic & industrial experience in carrying out engineering analysis (Thermal, Fluids, Structural ), design of experiment (DOEs ... Nettet27. mai 2024 · The impact score (IS) 2024 of Journal of Japan Institute of Electronics Packaging is 0.06, which is computed in 2024 as per its definition.Journal of Japan Institute of Electronics Packaging IS is increased by a factor of 0.02 and approximate percentage change is 50% when compared to preceding year 2024, which shows a …
NettetThe IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing. Home - IEEE Electronics Packaging Society Join IEEE Sign In IEEE.org IEEE XploreDigital Library IEEE … NettetIEEE Transactions on Components, Packaging and Manufacturing Technology . NEW: The IEEE Transactions on Components, Packaging and Manufacturing Technology will now include a Letters section within the publication. Papers will be a maximum of 4 pages and relate to the research and application on modeling, design, building blocks, …
NettetThis journal covers materials, processes, reliability, design, systems, and applications in microelectronics assembly and packaging technologies of the present and future including 3D integration, Ceramic Interconnect, Soldering, Flip Chip, Wire Bonding, Encapsulation, RF and microwaves, MEMS, Photonics, Power/High Temperature Electronics, … NettetThe 2024 impact factor of Journal of Electronic Packaging is 1.4, making it among the top 10% journals. The previous impact factors of the journal are displayed in the …
Nettet24. nov. 2024 · JABA is published twice a year, in March and September, and the electronic PDF version is accessible on the internet free of charge. All interested contributors are encouraged to submit their work for consideration, and the e-ISSN is 2548-9909. ... Journal Impact Factor Report 2024 imhotep egyptianNettetThe latest impact factor of JOURNAL OF ELECTRONIC PACKAGING and all the other SCI journals has been released on 30th June 2024 by Clarivate. Through this web … imhotep famineNettetIEEE Transactions on Components, Packaging and Manufacturing Technology. The articles in this journal are peer reviewed in accordance with the requiremen IEEE … imhotep expansionNettet27. mai 2024 · The impact score (IS) 2024 of Journal of Electronic Packaging, Transactions of the ASME is 1.92, which is computed in 2024 as per its definition. … imhotep faceNettet27. mai 2024 · The impact score (IS) 2024 of Packaging Technology and Science is 2.49, which is computed in 2024 as per its definition. Packaging Technology and Science IS is increased by a factor of 0.51 and approximate percentage change is 25.76% when compared to preceding year 2024, which shows a rising trend. imhotep egyptian god of medicineNettetImpact Factor: 1.931. Citescore: 3.7. SCIMAGO SJR: 0.493. SCIMAGO H-index: 55. Research Ranking (Mechanical and Aerospace Engineering) 198. Research Ranking (Engineering and Technology) 956. Number of Best scientists*: 9. Documents by best scientists*: 17. ... Journal of Electronic Packaging, ... imhotep football maxprepsNettetEffect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging Article Full-text available imhotep first physician